In 2023, Advantech, a supplier of industrial embedded AI solutions, released the industrial barebone EPC-R7300, which is suitable for NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano modules. Leveraging the powerful NVIDIA Jetson Orin module, the EPC-R7300 will output 20-100TOPS of AI performance with low power consumption (7~25 watts). To facilitate AI deployment, the EPC-R7300 adopts a very compact form factor (152×173×50 mm) with a variety of rear I/O configurations. Its excellent flexibility and computing performance provide guarantees for the next generation of robots, monitoring and other applications using edge reasoning.

Highly reliable single AI kit for NVIDIA Jetson Orin NX and Orin Nano

Advantech’s EPC-R7300 industrial barebone is equipped with a production carrier board and mainstream I/O functions, including RS-485, CAN bus and multiple Ethernet ports, and is fully compatible with NVIDIA Jetson Orin NX and Orin Nano modules to meet the various computing needs of developers. The EPC-R7300 will be equipped with NVIDIA JetPack 5.1, making it easy to migrate from NVIDIA development kits to barebones PCs and between different Jetson Orin modules. It will also help AI developers automatically start I/O without further driver installation or configuration. Edge AI applications include image reasoning, which requires high-quality camera image information input. Therefore, the EPC-R7300 provides USB, IP, and MIPI-CSI camera interfaces for smart vision-based systems. It also has 1 HDMI 2.0 port for 4K resolution displays, 2 GbE LAN for data connectivity, 2 USB 3.2 Gen 1 ports, and 3 M.2 slots for wireless modules and storage expansion (1 2230 E Key for Wi-Fi 6 and Bluetooth, 1 3042/52 B Key for 4G/5G, and 1 2280 M Key for NVMe SSDs).

In terms of ruggedness, Advantech EPC-R7300 can withstand wide temperature operation and high power input, and has a high vibration tolerance (-40~85°C/-40~185°F; 9~36 V DC; 3.0Grms). This in turn helps users generate field prototypes while significantly reducing the development time and resources required for system integration, verification, and conversion to a ready-to-use edge AI system.

Different rear I/O configurations to meet various application requirements

Designed to meet different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to achieve system capacity expansion. I/O peripheral drivers are all integrated into the motherboard support package (BSP) of NVIDIA JetPack 5.1, making the functional output of the EPC-R7300 excellent enough without the need for additional integration work.

ROS 2 Kit Ready for Robotics Development and Integration

These Jetson platforms support ROS 2 Kit. ROS 2 Kit is a coordinated and verified software package based on Advantech AIM-Linux embedded software, designed to support the Robot Operating System (ROS) environment. ROS 2 Kit includes SUSI API. SUSI is a set of application program interfaces that enable users to directly monitor and control digital I/O, I2C, and watchdog timer. Considering ROS industrial applications, industrial protocols and edge time series database software are also deployed. In addition, common ROS utilities such as RVIZ and MoveIt are pre-integrated to shorten application development time. Isaac ROS SDKs will be integrated into ROS 2 Kit to improve edge intelligence efficiency using the GPU inside the processor. With high software integration, EPC-R7300 significantly reduces the time and resources required for robot development.

Advantech EPC-R7300 products will be available in the second quarter of 2023

Advantech’s embedded industrial fanless system EPC-R7300 is compact in size and highly compatible. It is equipped with five rear I/Os to meet different needs, supports wide temperature operation, and the POS 2 kit supports robot development.
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